Rigid Flex PCB

Rigid Flex PCB Manufacturing

365PCB manufactures custom 4–12-layer rigid-flex PCBs that combine FR-4 rigid sections and polyimide flex sections in one interconnected structure. Engineering review covers the regional stackup, bend zones, laser microvias, controlled impedance, coverlay, local reinforcement and assembly requirements before production.

Looking for quality Rigid-Flex PCBs? We offer custom multilayer rigid-flex circuit boards with fast prototyping, IPC Class 3, and low MOQ.

Total copper layers: 4–12
Prototype MOQ: 1 piece
Typical prototype planning range: 7–9 days
Production: 12–18 working days
Polyimide base material + FR4
Laser microvias & selective stiffeners
IPC-6013, ISO 9001, UL, RoHS certified
Controlled impedance & EMI shielding

What is a rigid-flex PCB?

One laminated circuit across rigid and bendable regions

A rigid-flex PCB is a printed circuit in which rigid board sections and flexible circuit sections are integrated into one finished part. Copper layers continue through selected regions of the construction, allowing the flex section to fold or move while the rigid areas support components, connectors and mechanical attachment.

This is different from connecting independent rigid boards with a removable cable. A properly planned rigid and flexible PCB can reduce connector count, save assembly space and control interconnect geometry, but the benefit depends on a stackup and mechanical design developed for the real bend condition.

As a rigid flex PCB manufacturer and rigid flex PCB supplier, 365PCB supports design review, rigid flex PCB fabrication, bare-board testing and optional assembly. Projects can also draw on our broader PCB manufacturing capabilities and PCB design support services.

Rigid flex PCB manufacturing capabilities

The table below is a practical starting point. Final producibility is determined from the complete regional stackup, finished thicknesses, via structure, flex geometry, material availability and inspection plan.

Item	Typical capability	What to define in the RFQ
Layer count	4–12 total copper layers	Identify the layers present in each rigid region and the layers that continue through every flex region.
Materials	Polyimide flex core with FR-4 rigid sections	Include finished thickness, copper weight, coverlay and bonding requirements. Specialty materials are reviewed by stackup.
Via structures	Plated through holes, blind/buried vias and laser microvias, subject to stackup	Mark via types, target layers, filled/capped requirements and any via-in-pad locations.
Impedance control	Single-ended and differential structures by engineering review	Provide target impedance, tolerance, reference layer, trace geometry and coupon or report requirement.
Flex-region features	Coverlay, selective stiffeners, local reinforcement and EMI shielding options	Show flex boundaries, stiffener outlines, thickness, shielding termination and adhesive keepouts.
Surface finish	Selective finish options based on exposed pad and connector functions	Identify solderable pads, contact fingers, mating areas and any thickness requirements.
Acceptance criteria	IPC-6013 Class 2 or Class 3 project requirements can be reviewed	State the required class, applicable drawing notes, sampling plan and any customer-specific criteria.
Production scope	Rigid-flex PCB prototype through volume production, with optional assembly	Provide prototype and forecast quantities so tooling, panelization and sourcing can be planned together.

Specify What Exists in Each Part of the Board

A rigid-flex stackup must describe more than the total layer count. In many designs, only selected copper layers continue through the flexible span while additional copper and dielectric layers build the rigid component areas. The flex-to-rigid transition also needs its own definition because material and copper edges create local changes in stiffness.

Region	Key definition
Rigid area	Layer sequence, FR-4 thickness, copper weight, via span, component side and finished thickness.
Transition zone	Rigid material edge, coverlay overlap, adhesive condition, copper features, routing clearance and strain-relief geometry.
Flex area	Flex layers, polyimide and coverlay thickness, bend direction, bend radius, shielding and dynamic or static use.

Important: “12-layer rigid-flex PCB” describes the total construction; it does not automatically mean that all 12 copper layers pass through every bendable region.

Rigid-flex PCB Fabrication Process

Manufacturing is planned as a controlled sequence so the flexible core, rigid build-up, via structures and exposed flex areas remain registered through lamination and finishing.

Engineering and DFM review
Files, regional stackup, material callouts, bend notes, via spans, controlled-impedance requirements and acceptance criteria are checked together.
Flex circuitry and coverlay
The flexible copper circuitry is formed, inspected and aligned with coverlay openings, stiffener locations and the defined transition geometry.
Rigid-flex layup and lamination
Flex cores, rigid materials, copper foils and bonding layers are registered and laminated according to the approved construction.
Drilling, plating and build-up
Mechanical holes and, where specified, laser microvias are processed in the sequence required by the via structure and layer connections.
Outer-layer finishing
Outer circuits, solder mask in rigid areas, selective finish, legend and final profiling are completed while protecting exposed flex sections.
Inspection and release

Projects with dense interconnects can combine rigid-flex construction with HDI PCB technology, laser-drilled microvias and sequential lamination. The number of build-up cycles and microvia structure should be agreed before layout completion.

Rigid Flex PCB Applications

Rigid-flex construction is most useful when connector elimination, repeatable folding, low mass or packaging into multiple planes creates a measurable system advantage.

Aerospace systems

Navigation electronics, sensors and compact modules where vibration, mass and interconnect retention must be considered together.

Medical devices

Portable diagnostics, compact instruments and sensor assemblies that require controlled packaging and documented acceptance criteria.

Consumer electronics

Wearables, cameras and foldable or space-constrained products with circuit sections arranged across multiple planes.

Automotive electronics

Cameras, displays, controls and sensor modules where connectors and wiring must fit within restricted spaces.

Industrial equipment

Robotics, motion-control assemblies and instrumentation with moving sections or constrained internal routing.

Defense electronics

Compact communication and control assemblies produced to the drawings, test conditions and documentation required by the project.

Rigid flex PCB assembly under One Project

Rigid-flex PCB assembly requires mechanical support for thin flex tails and transition areas during printing, placement, reflow, handling and inspection. Tooling strategy, panel retention, stiffener thickness and component-side definition should be reviewed before the bare boards are released.

365PCB can combine fabrication with component sourcing, SMT assembly, BGA placement and project-defined testing. X-ray inspection is used where hidden assembled solder joints require evaluation; it is not a substitute for bare-board electrical testing.

For a complete PCBA review, see our dedicated flex and rigid-flex PCB assembly service, general PCB assembly services, and BGA and fine-pitch assembly capabilities.