Rigid Flex PCB

• Aerospace: Navigation systems, satellite electronics

• Medical: Portable diagnostic devices

• Consumer Electronics: Foldable phones, smartwatches

• Military: Rugged communication systems

• Industrial: Robotics, motion control boards

• Up to 12-layer rigid-flex PCB

• Polyimide base material + FR4

• Laser microvias & selective stiffeners

• IPC-6013, ISO 9001, UL, RoHS certified

• Controlled impedance & EMI shielding

• Prototyping: 7–9 working days

• Production: 12–18 working days

• MOQ: 1 piece for prototyping

“The rigid-flex PCBs we received passed extreme vibration testing for our aerospace applications. The stack-up was precise and delivery was fast.” — Martin K., Aerospace Systems Lead, Aerotronix GmbH

Q1: Do you support 10-layer rigid-flex PCB manufacturing?

A: Yes, we manufacture 4–12 layer rigid-flex PCBs with precise stack-ups and impedance control.

Q2: What materials are used in your flexible circuit boards?

A: We use polyimide, PET, and FR4 combinations for rigid-flex and flexible PCBs.

Q3: Can rigid-flex PCBs support fine-pitch components like BGA?

A: Yes, we support HDI rigid-flex PCBs with laser-drilled microvias and BGA compatibility.

Q4: Do you have IPC Class 3 rigid-flex PCB capability?

A: Yes, we are IPC Class 3 certified, suitable for high-reliability applications.

Q5: What's the lead time for a multilayer rigid-flex PCB prototype?

A: Typically 7–9 days depending on the layer count and complexity.