Flex-Rigid Board

• Defense: Missile guidance and avionics

• Industrial: Robotics and control systems

• Medical: Implants and imaging devices

• Smart Devices: Foldable displays and wearables

• Telecommunications: Antenna systems

• Stack-ups: 2–12 layers with flex-rigid integration

• Laser via drilling, coverlay processing

• EMI shielding & stiffener support

• IPC Class 2 & 3, UL, ISO 13485 (medical-ready)

• Prototypes: 8–10 working days

• Production: 14–20 working days

• MOQ: 1 piece

“The flex-rigid PCBs delivered by China 365PCB significantly reduced our failure rates in high-vibration environments.” — Ivan Petrov, Project Engineer, TelcomAvionics Ltd.

Q1: What layer configurations are available for flex-rigid PCBs?

A: We offer 2–12 layer custom flex-rigid stack-ups with selective via fills and laser vias.

Q2: Can I use flex-rigid boards in medical devices?

A: Yes, we are ISO 13485 certified and have experience with implantable and diagnostic device PCBs.

Q3: Do your flex-rigid boards meet IPC Class 3?

A: Yes, we manufacture to IPC Class 2 or 3 depending on your requirements.

Q4: How do you handle EMI shielding on flex-rigid boards?

A: We support EMI shielding via copper mesh, polyimide overlay, or special coatings.

Q5: Are stiffeners available on the flexible sections?

A: Yes, we offer stiffener support for critical areas using PI, FR4, or stainless steel.