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China 365PCB Technology Co., Ltd.
  • immersion tin pcb
  • immersion tin pcb

Immersion Tin PCB

Our immersion tin (ISn) finish delivers superior planarity and reliable solderability, making it an ideal alternative to HASL and OSP for demanding PCB applications.

What is Immersion Tin (ISn) Finish?

Immersion tin is a metallic coating plated onto copper via a chemical displacement reaction, forming a thin (0.8-1.5µm), uniform layer that prevents oxidation.

Key Features

✔ RoHS & lead-free compliant – Safe for modern electronics
✔ Super flat surface – Ideal for ultra-fine-pitch components
✔ Excellent solderability – Forms strong intermetallic bonds
✔ Economical alternative to ENIG – Lower cost with good performance
✔ Suitable for press-fit connectors – Better than ENIG for mechanical insertion

Best Applications

  • Fine-pitch BGA & QFN components

  • High-speed & RF/Microwave PCBs

  • Automotive & consumer electronics


  • Press-fit connector applications


Why Choose Immersion Tin PCB Finish?

✔ Superior flatness – More reliable than HASL for SMT assembly
✔ Great shelf life (~12 months) – Better than OSP with proper storage
✔ Lead-free & eco-friendly – No hazardous metals like lead or nickel
✔ Solder joint reliability – Stronger than ENIG for multiple reflows
✔ Lower cost than ENIG – Affordable high-performance finish

Limitations

  • Not wire-bondable – ENIG/ENEPIG is better for IC packaging

  • Requires dry storage – Moisture and sulfur exposure can degrade tin

  • Thickness control critical – Too thin = poor protection; too thick = brittleness


How Immersion Tin PCB Coating Works

Step-by-Step Process

  • Copper Cleaning – Alkaline wash removes oxides and contaminants

  • Micro-Etching – Roughens copper for better adhesion

  • Pre-Dip Treatment – Prevents oxidation before tin deposition

  • Tin Plating – Chemical displacement deposits tin (0.8-1.5µm)

  • Post-Treatment & Drying – Ensures uniform coating & stability

Critical Parameters

  • Tin thickness (0.8-1.5µm) – Ensures durability without brittleness

  • Storage conditions (dry, anti-tarnish packaging) – Extends shelf life

  • Process control (pH, temperature) – Prevents tin whiskers


Immersion Tin vs ENIG, OSP, HASL


Feature

Immersion Tin

ENIG

OSP

HASL

Cost

$$

$$$

$

$

Flatness

★★★★☆

★★★★

★★★★★

★★☆

Solderability

★★★★

★★★★

★★★

★★★★

High-Freq Use

★★★★

★★★

★★☆

★★★

Shelf Life

12 mo

12+mo

6 mo

12 mo



Best Uses for ISn

✓ High-frequency & RF PCBs – Low signal loss
✓ Fine-pitch/BGA components – Better than HASL
✓ Press-fit & mechanical connectors – More reliable than ENIG



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