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Our immersion tin (ISn) finish delivers superior planarity and reliable solderability, making it an ideal alternative to HASL and OSP for demanding PCB applications.
Immersion tin is a metallic coating plated onto copper via a chemical displacement reaction, forming a thin (0.8-1.5µm), uniform layer that prevents oxidation.
Key Features
✔ RoHS & lead-free compliant – Safe for modern electronics
✔ Super flat surface – Ideal for ultra-fine-pitch components
✔ Excellent solderability – Forms strong intermetallic bonds
✔ Economical alternative to ENIG – Lower cost with good performance
✔ Suitable for press-fit connectors – Better than ENIG for mechanical insertion
Best Applications
Fine-pitch BGA & QFN components
High-speed & RF/Microwave PCBs
Automotive & consumer electronics
Press-fit connector applications
✔ Superior flatness – More reliable than HASL for SMT assembly
✔ Great shelf life (~12 months) – Better than OSP with proper storage
✔ Lead-free & eco-friendly – No hazardous metals like lead or nickel
✔ Solder joint reliability – Stronger than ENIG for multiple reflows
✔ Lower cost than ENIG – Affordable high-performance finish
Limitations
Not wire-bondable – ENIG/ENEPIG is better for IC packaging
Requires dry storage – Moisture and sulfur exposure can degrade tin
Thickness control critical – Too thin = poor protection; too thick = brittleness
Copper Cleaning – Alkaline wash removes oxides and contaminants
Micro-Etching – Roughens copper for better adhesion
Pre-Dip Treatment – Prevents oxidation before tin deposition
Tin Plating – Chemical displacement deposits tin (0.8-1.5µm)
Post-Treatment & Drying – Ensures uniform coating & stability
Tin thickness (0.8-1.5µm) – Ensures durability without brittleness
Storage conditions (dry, anti-tarnish packaging) – Extends shelf life
Process control (pH, temperature) – Prevents tin whiskers
Feature | Immersion Tin | ENIG | OSP | HASL |
Cost | $$ | $$$ | $ | $ |
Flatness | ★★★★☆ | ★★★★ | ★★★★★ | ★★☆ |
Solderability | ★★★★ | ★★★★ | ★★★ | ★★★★ |
High-Freq Use | ★★★★ | ★★★ | ★★☆ | ★★★ |
Shelf Life | 12 mo | 12+mo | 6 mo | 12 mo |
Best Uses for ISn
✓ High-frequency & RF PCBs – Low signal loss
✓ Fine-pitch/BGA components – Better than HASL
✓ Press-fit & mechanical connectors – More reliable than ENIG