Service Hotline: +86-13612997580 (wechat/whatsapp)
Email: sales@365pcb.com
Premium SMT stencil manufacturing services including laser-cut, electroformed, step, and fine pitch stencils. Fast turnaround, custom sizes, and precision for PCB assembly.
China 365PCB specializes in high precision SMT stencil manufacturing, utilizing advanced laser-cut stainless steel, electroformed, and step stencil technologies. Our SMT stencils accommodate fine pitch components such as 01005, 0201, BGA, and QFN packages. Available in various thicknesses (0.1mm to 0.3mm) and finishes including electropolished and matte, our stencils ensure optimal solder paste deposition for high-yield PCB assembly. We also provide custom SMT stencil manufacturing and quick turn stencil services to meet your prototype and volume production needs.
Laser-cut Stainless Steel Stencil
Durable 304/316 stainless steel, high precision (±2µm aperture accuracy) — suitable for 90% of SMT applications (0201 to BGA)
Electroformed SMT Stencil
Nickel electroforming process, ultra-fine apertures (down to 2 mils) — ideal for high-density PCBs, microchips, and 01005 components
Step Stencil
Variable thickness zones (0.1mm–0.3mm) in one stencil — solves mixed component height issues (e.g., BGA + passive components)
Flexible Polyimide Stencil
Lightweight, flexible polyimide material — cost-effective for prototypes, low-volume production, and small-size PCBs
Consumer Electronics: SMT stencils for smartphones, wearables, and home appliances (fine pitch 01005/0201 components)
Automotive Electronics: High-temperature resistant stencils for engine control units (ECUs) and ADAS modules
Medical Devices: Precision stencils for diagnostic equipment PCBs (low defect rate, ISO compliance)
Telecommunications: High-density stencils for 5G base station PCBs and data center servers
Industrial Automation: Durable stencils for PLCs and sensor control boards (heavy-duty use)
Key Precision Parameters
Aperture Size Accuracy: ±2µm (ensures consistent solder paste volume)
Thickness Options: 0.1mm (fine pitch) to 0.3mm (thick paste for large components)
Maximum Stencil Size: Up to 610mm × 610mm (supports large PCB panels)
Surface Finishes
Electropolished: Smooth surface, reduces solder paste adhesion (ideal for fine apertures)
Matte: Enhanced solder paste release for high-volume production
Anti-Stick Coating: PTFE-based coating, minimizes paste residue (for lead-free solder)
Industry Certifications
IPC-SM-840 (global standard for SMT stencil manufacturing)
ISO 9001 (quality management system certification)
Lead Time & MOQ
Prototype Stencils: 3–5 business days (includes Gerber file review and aperture optimization)
Volume Production Stencils: 7–10 business days (supports batch orders of 100+ units)
MOQ: 1 piece (prototypes, ideal for R&D projects); bulk order discounts available for 50+ units
Expedited Service: 2–3 business days for urgent prototype needs (additional fee applies)
Ultra-precision technology: Advanced laser cutting (±2µm accuracy) for fine pitch 01005/BGA components
Flexible production: Supports 1-piece prototypes to 1000+ unit bulk orders, matching R&D to mass production needs
Rigorous quality control: 100% aperture inspection (AOI testing) to eliminate defective stencils
Global service: Competitive pricing with reliable shipping to 50+ countries; multi-language technical support
Engineering optimization: Free Gerber file review to adjust aperture size/shape for optimal solder paste deposition
“China 365PCB’s laser-cut SMT stencils dramatically improved our paste printing quality for fine pitch PCBs.”
– Michael T., Process Engineer, Techtronics Ltd.
“Fast delivery and excellent stencil precision. Our go-to supplier for prototype and volume SMT stencils.”
– Sarah L., Production Manager, ElectroMed Inc.
Q1: What types of SMT stencils do you manufacture?
A1: We manufacture four core types: laser-cut stainless steel (general use), electroformed (fine pitch), step (mixed component heights), and flexible polyimide (prototypes/low-volume).
Q2: Can you produce stencils for fine pitch components such as 01005 and BGA?
A2: Yes, our electroformed stencils support ultra-fine apertures down to 2 mils, ideal for 01005 passive components, BGA (ball grid array), and QFN (quad flat no-lead) packages.
Q3: What thickness options are available for your SMT stencils?
A3: We offer thicknesses from 0.1mm (for fine pitch components) to 0.3mm (for thick solder paste needs, e.g., large through-hole components). Step stencils can combine multiple thicknesses in one unit.
Q4: Do you provide quick turn SMT stencil services?
A4: Yes, prototype stencils can be delivered within 3–5 business days, and we offer an expedited 2–3 day service for urgent R&D or production needs.
Q5: Are your SMT stencils compliant with industry standards?
A5: Absolutely, all our SMT stencils meet IPC-SM-840 (the global standard for SMT stencil quality) and ISO 9001, ensuring compatibility with international PCB assembly processes.