High-speed PCB

At China 365PCB, we specialize in the design, fabrication, and assembly of High-Speed Printed Circuit Boards (PCBs) that are critical for next-generation digital and RF systems. Our manufacturing expertise ensures precise impedance control, minimized signal loss, and superior electromagnetic performance—delivering the foundation your high-speed designs demand for reliable, first-pass success.

Our Core Capabilities

Advanced Materials: We work with industry-leading low-loss, low-Dk/Df laminates (Rogers, Taconic, Isola, Panasonic, etc.) to meet your specific signal speed and thermal management requirements.
Precision Impedance Control: Guaranteed tight impedance tolerances (typically ±10% or better) through controlled dielectric thickness, precise trace geometry, and advanced simulation-backed processes.
High-Density Interconnect (HDI) Integration: Microvias, stacked/blind vias, and fine-line tracing to support complex, high-pin-count BGAs and chip-scale packages common in high-speed designs.
Comprehensive Signal Integrity Support: In-house DFM analysis focused on high-speed challenges: minimizing crosstalk, optimizing return paths, managing skew, and ensuring power integrity.

Key Technologies & Features

Back Drilling (Controlled Depth Drilling): To remove unwanted via stubs that cause signal reflections at multi-gigabit rates.
Any-Layer HDI & Via-in-Pad: For optimal routing density and performance in space-constrained, high-speed designs.
Stripline & Microstrip Configurations: Precise construction for controlled impedance transmission lines.
Advanced Surface Finishes: Offering ENIG, ENEPIG, Immersion Silver, and Hard Gold to suit signal frequency and assembly needs.