Semiconductor Test PCB

Core Features & Advantages

• Superior Signal Integrity:
  Precise impedance control, optimized layer stacking, and low-loss materials minimize skew, crosstalk, and attenuation for high-speed digital, RF, and mixed-signal testing.

• High Reliability & Durability:
  Engineered to withstand thousands of test cycles, mechanical stress, and thermal fluctuations without performance degradation.

• Rapid Customization & Turnaround:
  Fast prototyping and volume production support for probe cards, load boards, interface PCBs, and custom test fixtures.

• Advanced Design for Testability:
  Integrated features such as high-density probing pads, controlled impedance channels, and optimized ground/power planes for accurate measurements.

• ATE Compatibility:
  Designed to interface seamlessly with major ATE platforms (Teradyne, Advantest, etc.) and probe stations.

Typical Specifications

• Materials: High-frequency laminates (Rogers, Megtron), low-loss FR4

• Layer Count: 4 to 30+ layers

• Minimum Trace/Space: Down to 50µm/50µm

• Impedance Control: Tight tolerances (±5–8%) for critical nets

• Surface Finishes: ENIG, ENEPIG, hard gold (for probing areas)

• Special Features: Buried vias, back drilling, cavity designs, and custom pad finishes

Primary Applications

• Wafer-Level Testing: Probe cards for CP (Chip Probing) and wafer sorting

• Final Test: Load boards and interface PCBs for packaged IC validation

• Engineering Characterization: Prototype validation and performance benchmarking

• System-Level Test: Burn-in boards, reliability test fixtures

Partner with Our Test PCB Specialists

From initial design collaboration to high-volume manufacturing, we provide full support—including signal integrity simulation, DFM analysis, and stringent quality control. Leverage our experience in high-speed, high-density PCB fabrication to accelerate your semiconductor testing and validation cycles.