BGA / QFN / Fine Pitch PCB Assembly

Expert BGA, QFN, and fine pitch PCB assembly services with advanced equipment and quality control. Ideal for high-density, complex electronics production.

At China 365PCB, we specialize in BGA assembly, QFN PCB assembly, and fine pitch PCB assembly for high-density, precision electronic devices. Our state-of-the-art SMT lines and experienced technicians ensure accurate placement and soldering of challenging components with fine pitch leads as small as 0.2mm. We provide full turnkey and consigned assembly services supporting ball grid array (BGA) packages, quad flat no-lead (QFN) chips, and other fine-pitch devices crucial for advanced consumer electronics, medical equipment, aerospace, and telecommunications.

Keywords included: BGA assembly, QFN PCB assembly, fine pitch PCB assembly, ball grid array assembly, QFN soldering, fine pitch SMT assembly, micro pitch PCB assembly, precision PCB assembly

Application Areas

High-performance computing devices
Mobile phones and tablets
Medical diagnostic instruments
Aerospace and defense electronics
Telecommunications infrastructure
IoT and wearable technology
Advanced automotive electronics

Technical Capabilities & Certifications

Component Types: BGA, QFN, QFP, CSP, micro BGA, fine pitch QFN
Minimum Pitch: Down to 0.2 mm
Assembly Methods: Lead-free (RoHS) and tin-lead soldering
Inspection: Automated Optical Inspection (AOI), X-ray, functional testing
Board Layers: 1 to 20+ layers
Certifications: IPC-A-610 Class 2/3, ISO 9001, RoHS compliant
File Formats Accepted: Gerber, BOM, Pick & Place, Assembly Drawings

Lead Time & MOQ

Assembly Type	Lead Time	MOQ
BGA / QFN / Fine Pitch Assembly	5–10 business days	5 pcs minimum
Prototype & Low Volume	3–5 business days	1–50 pcs

Why Choose Our BGA, QFN & Fine Pitch PCB Assembly

Precision Placement – Advanced machines ensure accurate soldering of fine-pitch components
Comprehensive Testing – X-ray and AOI detect hidden solder defects under BGAs
Experienced Technicians – Skilled operators trained for complex packages
Fast Turnaround – Rapid prototype and low volume assembly service available
Global Shipping – Reliable worldwide delivery with tracking
Responsive Support – Engineering assistance for DFM and design optimizations

Customer Testimonials

“China 365PCB’s fine pitch assembly service was flawless, especially with our micro-BGA chips. Great quality and communication.” – David K., Electronics Engineer, Techwave Solutions

“Their QFN assembly capability helped us launch our medical device on time with zero defects.” – Emily R., Product Manager, MediTech Instruments

Application Scenarios & Client Recommendations

Mobile Device Production: Challenge – Tiny, dense components Suggestion: Submit detailed BOM and pick & place files early
Aerospace Electronics: Challenge – Reliability and precision Suggestion: Request IPC Class 3 assembly and strict quality controls
Medical Instruments: Challenge – Complex multi-layer boards Suggestion: Opt for functional testing and traceability reporting
IoT Wearables: Challenge – Small form factor Suggestion: Use fine pitch PCB assembly with experienced operators
Telecom Equipment: Challenge – High frequency and density Suggestion: Ensure controlled impedance and proper solder mask design