Buried Via PCB

Our advanced buried vias PCB technology enables ultra-compact multilayer boards with superior signal performance, trusted by aerospace, medical, and telecom industries.

Precision Buried Vias PCB Solutions for HDI Applications

We manufacture buried via PCB designs with laser-drilled blind vias and sequential lamination for maximum layer interconnection density.

Key Features:
✔ Buried vias fully encapsulated between inner layers (no surface exposure)
✔ Combined blind buried vias support for ultra-HDI designs
✔ PCB blind via fabrication process compliant with IPC-6012 Class 3
✔ Material options: FR-4, Rogers, Polyimide for high-frequency needs
✔ Traceability via MES system for quality assurance

H2: What is a Buried Via PCB?

A buried via PCB contains copper-plated holes that connect internal layers only, invisible from the board’s surface.

How It Works:

Laser drilling creates micro-vias between specified inner layers.
Sequential lamination bonds layers while encapsulating vias.
Electroplating ensures conductivity between connected layers.

Buried Vias vs. Blind Vias vs. Through-Hole Vias

Feature	Buried Vias	Blind Vias	Through-Hole Vias
Layer Connection	Inner layers only	Outer → Inner layers	All layers
Fabrication Cost	$$$ (Highest)	$$	$
Best For	8+ layer boards	Space-saving HDI	Simple designs