Service Hotline: +86-13612997580 (wechat/whatsapp)
Email: sales@365pcb.com
Reliable HDI PCB manufacturing with microvias, blind/buried vias, and fine lines. Ideal for smartphones, medical devices & aerospace electronics.
At China 365PCB, we specialize in HDI PCB (High-Density Interconnect Printed Circuit Boards), engineered for superior performance in compact, high-speed applications. Our HDI boards feature laser-drilled microvias, blind & buried vias, and ultra-fine lines/spacing, making them ideal for next-gen electronics.
Keywords: HDI PCB, high density interconnect PCB, microvia PCB, blind via board, HDI circuit board
• Smartphones & Tablets
• Wearable Devices
• Medical Equipment (e.g., pacemakers)
• High-Speed Networking Devices
• Aerospace Control Modules
• Min Trace/Space: 50/50μm
• Laser-drilled Microvias: ≤ 0.1mm
• Layer Count: Up to 16+
• Via Filling: Resin Plugging
• Impedance Control ±10%
• IPC Class 2 & 3 compliance
• ISO 9001, ISO 13485, UL certified
• Prototype: 5–7 working days
• Mass production: 10–14 days
• MOQ: 1 piece
“China 365PCB’s HDI boards exceeded our expectations—flawless microvias and exceptional impedance control.” — Lukas T., Switzerland
“We rely on their HDI production for our aerospace-grade modules. They never disappoint.” — David M., USA
Q1: Can you manufacture HDI PCBs with 3+ sequential buildup layers?
A1: Yes, we support HDI PCBs up to 3+N+3 structures with sequential lamination.
Q2: What is the minimum laser via size in your HDI circuit boards?
A2: We offer microvias down to 0.1mm in diameter, suitable for compact electronics.
Q3: Are HDI boards suitable for RF or high-speed digital applications?
A3: Absolutely. HDI PCB’s controlled impedance and short interconnects reduce signal loss.
Q4: Do you provide HDI PCBs with via-in-pad design?
A4: Yes, our advanced via-filling techniques support via-in-pad HDI structures.
Q5: Can I get quick-turn HDI PCB prototypes?
A5: Yes, our express service delivers HDI prototypes in as fast as 5 working days.