Service Hotline: +86-13612997580 (wechat/whatsapp)
Email: sales@365pcb.com
Precision laser drilled PCBs for HDI, microvia, and fine-line circuit designs. Ideal for wearable tech, medical and aerospace applications.
Our laser drilled PCB solutions are designed to meet the demands of high-density, multilayer interconnect designs. Using CO₂ and UV laser drilling, we create microvias with pinpoint accuracy, enhancing signal performance and board reliability.
Keywords: laser drilled PCB, microvia board, HDI laser PCB, laser via drilling, laser hole PCB
• HDI Smartphones & Tablets
• Smart Watches & Wearables
• RF Modules & Antennas
• Medical Monitoring Devices
• Industrial IoT Sensors
• Laser Via Diameter: 0.1–0.15mm
• Drilling Tolerance: ±0.01mm
• Max Layers: 16+
• Blind/Buried Via Support
• AOI & X-ray via inspection
• Certifications: ISO 9001, UL, RoHS
• Samples: 5 days
• Volume Orders: 10–12 days
• MOQ: 1 set
“Their laser-drilled boards allow us to build truly compact RF modules with perfect alignment.” — Hideki S., Japan
“Reliable via quality and zero residue after laser—very satisfied with their microvia boards.” — Carlos D., Spain
Q1: What type of laser is used for microvia drilling in your PCBs?
A: We use CO₂ lasers and UV lasers depending on the layer stack and material.
Q2: Do you support stacked microvias in laser drilled PCBs?
A: Yes, we manufacture stacked and staggered microvias for multilayer designs.
Q3: What is the typical hole-to-pad registration tolerance?
A: Our laser via positioning tolerance is within ±10μm.
Q4: Are laser-drilled PCBs RoHS compliant?
A: Yes, all our PCBs including laser-drilled variants meet RoHS and REACH compliance.
Q5: Can you combine mechanical and laser drilling in one board?
A: Absolutely. Hybrid drilling solutions are available for complex HDI structures.