FC-CSP PCB

Core Features & Advantages

• Maximized Performance & Miniaturization: Engineered for high I/O count and minimal interconnect lengths, significantly reducing signal inductance and power loss for superior electrical performance in the smallest possible footprint.

• Advanced Build-up Technology: Employs sophisticated sequential build-up (SBU) processes with stacked microvias, enabling the ultra-high layout density required for leading-edge chip designs.

• Ultra-Fine Line Capability: Supports fine pattern formation with line/space dimensions down to 15/15 µm, accommodating the most complex routing needs of advanced ASICs, processors, and RFICs.

• Flexible Interconnection Solutions: Compatible with both array-type lead-free solder bumps and copper pillar bumps, offering optimal choices for electrical, thermal, and reliability requirements.

• Material Innovation: Offers both ETS (Embedded Trace Substrate) and coreless constructions to minimize thickness, improve signal integrity, and better match the CTE of the silicon die for enhanced reliability.

Technical Specifications

• Package Size Range: 3.0 x 3.0 mm to 15.0 x 15.0 mm

• Minimum Line/Space: 15 µm / 15 µm

• Minimum Bump Pitch: 100 µm

• Technology Options: ETS (Embedded Trace) & Coreless Substrates available

• Build-up Structure: High-Density Interconnect (HDI) with Stacked Microvias

• Surface Finish: ENIG, ENEPIG, or other finishes to suit bonding requirements

Primary Applications

This technology is essential for powering the next generation of compact, high-speed devices:

• Mobile & Wearable Electronics: Application Processors, RF Transceivers, PMICs

• High-Performance Computing: AI/ML Accelerators, Advanced ASICs

• Networking & Telecommunications: High-Speed SerDes and Optical Engine Chips

• Automotive Electronics: ADAS Sensors and Domain Controllers

Application

Applications of FC-CSP PCB