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China 365PCB Technology Co., Ltd.
  • ceramic pcb
  • ceramic pcb

Ceramic PCB

365PCB specializes in high thermal conductivity ceramic circuit boards (AlN: 180-230 W/mK) with 0.1mm laser-drilled microvias. IATF 16949 certified for automotive power modules.

What Are Ceramic PCBs?

"Ceramic substrate PCBs utilize Al₂O₃ (alumina), AlN (aluminum nitride), or BeO (beryllia) for extreme thermal management (>300°C continuous operation)."

Key Use Cases:

  • EV power inverters (SiC/GaN devices)

  • Spacecraft avionics (CTE matched to chips)


Ceramic PCB Materials Comparison (H2)

Material

Thermal Conductivity

Dielectric Strength

CTE (ppm/°C)

Max Temp

Alumina (96%)

24-28 W/mK

10 kV/mm

7.2

850°C

Aluminum Nitride

170-230 W/mK

15 kV/mm

4.5

1,000°C

LTCC (DuPont 951)

3-5 W/mK

1 kV/mm

5.8

500°C

"Our ceramic PCB material inventory includes CoorsTek, Maruwa, and KCC substrates with<0.5% porosity."


Ceramic PCB Manufacturing Process

Key Technologies:

  • Laser ablation for ≤50μm features

  • Thick-film printing (Au/Pd/Ag pastes)

  • High-temperature co-firing (HTCC) at 1,600°C


DBC vs. AMB Ceramic Boards

Direct Bonded Copper (DBC):

  • 0.3mm Cu layers with Cu-O eutectic bonding

  • Best for IGBT modules

Active Metal Brazing (AMB):

  • Superior thermal cycling resistance (>5,000 cycles)

  • 50% stronger than DBC


Design Guidelines for Ceramic Circuits

Critical Rules:

  • Minimum via size: 0.1mm (laser-drilled)

  • Trace spacing: ≥0.2mm for 1kV isolation

  • Corner radius: ≥0.3mm to prevent cracking


Quality Certifications

  • MIL-PRF-31032 for defense applications

  • AEC-Q200 for automotive electronics

  • RoHS/REACH compliant


Case Study: 48-Layer LTCC for Satellite Comm

"Achieved 0.025mm layer registration across 12 RF layers with embedded passives."



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