Ceramic PCB

365PCB specializes in high thermal conductivity ceramic circuit boards (AlN: 180-230 W/mK) with 0.1mm laser-drilled microvias. IATF 16949 certified for automotive power modules. Supported by professional PCB manufacturing services, we ensure stable production and consistent performance for all ceramic PCB projects.

What Are Ceramic PCBs?

"Ceramic substrate PCBs utilize Al₂O₃ (alumina), AlN (aluminum nitride), or BeO (beryllia) for extreme thermal management (>300°C continuous operation)."

Key Use Cases:

EV power inverters (SiC/GaN devices)
Spacecraft avionics (CTE matched to chips)

Ceramic PCB Materials Comparison (H2)

Material	Thermal Conductivity	Dielectric Strength	CTE (ppm/°C)	Max Temp
Alumina (96%)	24-28 W/mK	10 kV/mm	7.2	850°C
Aluminum Nitride	170-230 W/mK	15 kV/mm	4.5	1,000°C
LTCC (DuPont 951)	3-5 W/mK	1 kV/mm	5.8	500°C

"Our ceramic PCB material inventory includes CoorsTek, Maruwa, and KCC substrates with<0.5% porosity."

Ceramic PCB Manufacturing Process

Key Technologies:

Laser ablation for ≤50μm features
Thick-film printing (Au/Pd/Ag pastes)
High-temperature co-firing (HTCC) at 1,600°C

DBC vs. AMB Ceramic Boards

Direct Bonded Copper (DBC):

0.3mm Cu layers with Cu-O eutectic bonding
Best for IGBT modules

Active Metal Brazing (AMB):

Superior thermal cycling resistance (>5,000 cycles)
50% stronger than DBC

Design Guidelines for Ceramic Circuits

Critical Rules:

Minimum via size: 0.1mm (laser-drilled)
Trace spacing: ≥0.2mm for 1kV isolation
Corner radius: ≥0.3mm to prevent cracking

Quality Certifications

MIL-PRF-31032 for defense applications
AEC-Q200 for automotive electronics
RoHS/REACH compliant

Completed ceramic PCBs can be directly integrated into your system through reliable PCB assembly services for high-power and high-reliability applications.