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Our immersion silver finish offers a flat, conductive surface ideal for high-frequency PCBs, ensuring strong solder joints and excellent signal integrity.
Immersion silver is a thin (0.1-0.3µm) metallic coating deposited via displacement reaction onto copper, providing a smooth and solderable surface.
Key Features:
RoHS & lead-free compliant – Safe for modern electronics
Excellent high-frequency performance – Low signal loss for RF/microwave PCBs
Good solderability – Works with lead-free SAC alloys
Cost-effective – Cheaper than ENIG, better than OSP for specific uses
Best Applications:
High-speed digital circuits
RF/microwave & telecom PCBs
Fine-pitch/BGA components
Consumer electronics & automotive boards
✔ Superior signal integrity – Minimal skin effect losses at high frequencies
✔ Excellent solderability – Strong intermetallic bond formation
✔ Flat & uniform surface – Better than HASL for fine-pitch components
✔ Cost-effective alternative to ENIG – Lower cost with good performance
✔ Quick processing time – Faster than ENIG plating
Limitations:
Shelf life (6-12 months) – Needs airtight packaging to prevent tarnishing
Not wire-bondable – ENIG/ENEPIG preferred for IC packaging
Sensitive to handling – Requires gloves to avoid contamination
Copper cleaning – Removes oxides and contaminants
Micro-etching – Activates copper surface for silver deposition
Pre-dip treatment – Prevents oxidation before silver coating
Immersion silver plating – Displacement reaction deposits silver (0.1-0.3µm)
Post-treatment rinse & dry – Ensures uniform coating
Critical Parameters:
Silver thickness: 0.1-0.3µm (thicker = better shelf life, too thick = brittleness)
Storage condition: Must be vacuum-sealed to prevent sulfur/oxygen exposure
Feature | Immersion Silver | ENIG | OSP | HASL |
Cost | $$ | $$$ | $ | $ |
Flatness | ★★★★ | ★★★★ | ★★★★★ | ★★☆ |
High-Freq Performance | ★★★★★ | ★★★ | ★★☆ | ★★★ |
Solderability | ★★★★ | ★★★★ | ★★★ | ★★★★ |
Shelf Life | 6-12 mo | 12+mo | 6 mo | 12 mo |
Best Use Cases:
✓ Immersion Silver: High-speed digital, RF circuits
✓ ENIG: Long-term storage, wire bonding
✓ OSP: Low-cost, quick-turn SMT boards
✓ HASL: Cost-driven through-hole PCBs