Micro Via PCB

What is a Micro Via PCB?

A micro via PCB uses laser-drilled microvias (typically ≤150µm diameter) to connect adjacent layers in high-density interconnect (HDI) designs.

Key Advantages:

• Space-saving – Enables ultra-compact PCB layouts for miniaturized devices.

• Enhanced signal integrity – Shorter interconnects reduce latency & crosstalk.

• High reliability – Stacked or staggered microvias for complex multilayer routing.

• Suitable for advanced substrates – Works with flex, rigid-flex, and high-frequency materials.

Common Applications:

• Smartphones & wearables

• High-performance computing (HPC)

• Automotive ADAS systems

Microvias vs. Traditional Vias – Key Differences

Hybrid Design Tip: Combine microvias with buried/blind vias for maximum routing flexibility.

H2: Micro Via PCB Manufacturing Process

• Laser Drilling – CO₂/UV lasers create precise microvias in PCB (50–150µm).

• Desmearing – Removes resin residues for clean plating.

• Copper Plating – Electroless + electrolytic copper fills microvias.

• Stackup Lamination – Sequential builds for multi-layer HDI boards.

• Testing & Inspection – Microsection analysis & automated optical inspection (AOI).

Advanced Options:

• Stacked microvias (for ultra-HDI designs).

• Any-layer HDI (microvias on every layer).

Design Guidelines for Micro Via PCBs

✔ Pad size & spacing – Ensure sufficient capture pads (≥1.5x via diameter).
✔ Via-in-pad – Use plugged & plated microvias for fine-pitch BGA routing.
✔ Material selection – Low-Dk/Df materials for high-frequency designs.

H2: Applications of Micro Via Technology

• 5G RF Modules – Low-loss microvias for millimeter-wave circuits.

• Medical Implants – Extremely dense, biocompatible PCBs.

• Aerospace – Lightweight, high-reliability avionics.

H2: Why Choose Us for Micro Via PCBs?

• State-of-the-art laser drilling (≤50µm microvias).

• Fast prototyping (5-day lead time for HDI boards).

• Industry compliance – IPC-6012 Class 3, IATF 16949.